Read Full Article • Wed, Mar 20, 8:37am
LAST UPDATED: 05/20/2013, 12:28 AM EDT
PEREGRINE SEMICONDUCTOR CORP has reported these experts in their SEC filings. From underwriters to attorneys, these are the people influencing PEREGRINE SEMICONDUCTOR CORP’s IPO.
PassFail added 13 new financial items to our total of over 82 Videos, Articles, Blogs, & Podcasts on PEREGRINE SEMICONDUCTOR CORP. We update our news every 15 minutes from over 24,479 sources. We are finance.
Read Full Article • Wed, Mar 20, 8:37am
Read Full Article • Wed, Mar 20, 6:24am
Read Full Article • Wed, Mar 20, 5:58am
Read Full Article • Tue, Mar 19, 12:14pm
Read Full Article • Tue, Mar 12, 7:28am
Read Full Article • Fri, Mar 08, 2:15pm
Read Full Article • Wed, Mar 06, 7:46am
Read Full Article • Tue, Mar 05, 1:00pm
Read Full Article • Tue, Mar 05, 12:59pm
Raised in IPO
Expected Share Price
|Proposed Exchange||Nasdaq National Market|
|Expected Share Price||$14.00|
|Shareholder Shares Offered||$159,220|
|Locked Up Period Days||180|
|Locked Up Expiration||2013-02-04|
|Quiet Period Expiration||2012-09-17|
0 of Positive Articles have been written about PEREGRINE SEMICONDUCTOR CORP.
PEREGRINE SEMICONDUCTOR CORP IPO offering is $77,000,000.00.
At the current offering one share would be 0.
We are a fabless provider of high performance radio frequency integrated
circuits, or RFICs. Our solutions leverage our proprietary UltraCMOSÂ®
technology, which enables the design, manufacture, and integration of
multiple radio frequency, or RF, mixed signal, and digital functions on
chip. We believe our products deliver an industry leading
combination of performance and monolithic integration. Our solutions target
a broad range of applications in the aerospace and defense, broadband,
industrial, mobile wireless device, test and measurement equipment, and
wireless infrastructure markets. We have shipped over one billion RFICs
based on our UltraCMOS technology since January 1, 2006.
Our UltraCMOS technology combines the ability to achieve the high levels
of performance of traditional specialty processes, with the fundamental
benefits of standard complementary metal oxide semiconductor, or CMOS, the
most widely used semiconductor process technology. UltraCMOS technology
utilizes a synthetic sapphire substrate, a near-perfect electrical
insulator, providing greatly reduced unwanted electrical interaction
between the RFIC and the substrate (referred to as parasitic capacitance),
which enables high signal isolation and excellent signal fidelity with low
distortion over a broad frequency range (referred to as broadband linearity).
These two technical attributes result in RF devices with excellent
high-frequency performance and power handling performance, and reduced
crosstalk between frequencies. In addition, increased broadband linearity
provides for faster data throughput and greater subscriber capacity over
a wireless network, resulting in enhanced network efficiency. UltraCMOS
technology also provides the benefits of standard CMOS, such as high levels
of integration, low power consumption, reusable circuit libraries, widely
available design tools and outsourced manufacturing capacity, and the
ability to scale to smaller geometries. We own fundamental intellectual
property, or IP, in UltraCMOS technology consisting of more than 125 U.S.
and international issued and pending patents, and over 300 documented trade
secrets covering basic circuit elements, RF circuit designs, manufacturing
processes, and design know-how.
We leverage our extensive RF design expertise and systems knowledge to
develop RFIC solutions that meet the stringent performance, integration,
and reliability requirements of the rapidly evolving wireless markets.
As of June 30, 2012, we offer a broad portfolio of more than 160 high
performance RFICs including switches, digital attenuators, mixers /
upconverters, prescalers, digitally tunable capacitors, or DTCs, and DC-DC
converters, and we are currently developing power amplifiers, or PAs.
During the year ended December 31, 2011, our products were sold to more
than 1,500 module manufacturers, original equipment manufacturers, or OEMs,
contract manufacturers, and other customers, including such companies as
Ericsson AB, Flextronics International Ltd., Hitachi Metals, Ltd., Itron,
Inc., Jabil Circuit Inc., LG Innotek Co., Ltd., Mini-Circuits, Inc.,
Motorola Solutions, Inc., Murata Manufacturing Company, Ltd., Northrop
Grumman Corporation, Planet Technology Corp., Rockwell Collins, Inc.,
Rohde & Schwarz, Inc., SIPAT Co., Ltd., Skyworks Solutions, Inc., Sony
Corporation, Source Photonics, Inc., TDK-EPC Corporation, Thales Alenia
Space, and TriQuint Semiconductor, Inc. We believe our RFICs are included
in products sold by many of the leading mobile handset OEMs. For the years
ended December 25, 2010 and December 31, 2011, we generated net revenue of
$91.1 million and $107.8 million, respectively, representing year-over-year
growth of 18%. We generated net income of $3.8 million for the year ended
December 25, 2010 and a net loss of $9.7 million for the year ended
December 31, 2011. We recorded net revenu